TUBE CONNECTING APPARATUS

摘要

A tube bonder capable of performing temperature control of a wafer stably an d accurately even when a tube is bonded continuously. The tube bonder (1) comprises a heater (70) for heating a wafer holding section (5a), a thermist or (71) detecting the temperature at the wafer holding section (5a), a means (6 9) performing heating control of the heater (70) based on the output from the thermistor (71), and a means (68) for performing heating control of the wafe r (6) through constant power control. Before heating control of the wafer (6) is started by the wafer heating control means (68), heating control of the heat er (70) is performed by the heating control means (69) of the heater and the temperature at the wafer holding section (5a) is controlled to a constant level (about 65~C).