| 摘要 |
PROBLEM TO BE SOLVED: To extend the bonding life span by reducing stress concentration to the vicinity of bonding portions due to forming the bonding portions in a globoid-shape in the case of mounting electronic parts on a printed-circuit board. SOLUTION: A reflow heating is performed with a mounting surface of the printed-circuit board faced downward by inverting parts mounting surface of the printed-circuit board 3. On this occasion, by using a part 6 for adjusting a space between the electronic parts attached to a fixture 5 used for bonding and the printed-circuit board 3 to adjust the space, a soldering junction 4 is formed into the globoid-shape. COPYRIGHT: (C)2004,JPO
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