| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for semiconductors enabling assembling at a low temperature, remarkably improved in relaxation peak and thermal elastic modulus by heat treatment after assembling and excellent in strong adhesiveness and high resistance to moist heat. SOLUTION: The adhesive film for semiconductors comprises (A) 100 pts. wt. thermoplastic polyimide resin using a styrene/maleic anhydride copolymer and soluble in an organic solvent, (B) 10-150 pts.wt. thermosetting resin and (C) 0.1-5pts. wt. curing accelerator. In the thermoplastic polyimide resin, the styrene/maleic acid copolymer content is preferably 1-20mol% based on total carboxylic anhydride mol number expressed in terms of carboxylic acid anhydride mole number and diaminopolysiloxane is contained as a diamine component. COPYRIGHT: (C)2004,JPO |
