| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaged semiconductor device which is easily mounted on a mother board and is low-cost. <P>SOLUTION: The packaged semiconductor device comprises an integrated chip 1 having an integrated circuit 11 and first bump pads 12 formed in a narrow pitch; and a non-integrated chip 2 having second bump pads 21 so formed as to correspond to the first bump pads 12, lead pads 22 formed in a wide pitch (such a pitch as to allow for wire connection), and wires 23 for electrically connecting the pads. The chips 1 and 2 are connected via bumps and thereafter are sealed by resin to be fabricated into the packaged semiconductor device. <P>COPYRIGHT: (C)2004,JPO |
