| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayered circuit board where a surface protective resin layer is formed by electrodeposition on the peripheral part of a surface circuit wiring pattern and to provide its manufacturing method. <P>SOLUTION: The required circuit wiring pattern 2 is formed on the surface of the multilayered circuit board 1, and a mask 5, which is used for boring a connection opening 3 necessary for mounting of parts or connection to the other circuit board in a prescribed part of the circuit wiring pattern 2, is formed. Then, the surface protective layer 4 is formed by the use of insulating and heat-resistant electrodeposition resin on the peripheral part of the circuit wiring pattern 2 through an electrodeposition method, then the mask 5 is removed, and the connection opening 3 is formed. <P>COPYRIGHT: (C)2004,JPO</p> |
