| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be improved in flexural strength, and also to provide a method of manufacturing the same. SOLUTION: At prescribed positions of parts where side faces 21-1 to 21-4 and a rear face 21A of a semiconductor chip 21 cross each other, curved surfaces 22-1 to 22-4 of a curvature radius ranging between 0.5μm and 50μm are formed. By forming the edges on the rear face side of the semiconductor chip into curved surfaces, chipping which becomes an origin of cracks can be eliminated and, at the same time, the concentration of stress can also be suppressed, resulting in the improvement in flexural strength. COPYRIGHT: (C)2004,JPO |
