| 摘要 |
<P>PROBLEM TO BE SOLVED: To avoid cut burrs, which are produced in cutting lead terminals 2, 3, from protruding from either of front and rear surfaces of the lead terminals 2, 3, in an electronic part constituted by packaging the lead terminals 2, 3, which oppose elements of a semiconductor chip 4 and the like, so as to protrude from a molded part, in the synthetic resin made molded part 6. <P>SOLUTION: Main notches 7 and 8 for cutting are etched on either of front and rear surface 2b and 3b in the lead terminals in a process prior to a shaping process of the molded part by leaving parts 9, 10, 11 and 12 without notches on both ends. The lead terminals 2 and 3 are cut in parts of the main notches 7 and 8 in a process subsequent to the shaping process of the molded part. <P>COPYRIGHT: (C)2004,JPO |
