发明名称 |
SEMICONDUCTOR DEVICE AND RESIN BINDER FOR ASSEMBLING SEMICONDUCTOR DEVICE |
摘要 |
<p>In a semiconductor device of a structure comprising a thin semiconductor element bonded to a reinforcing plate via a bonding layer of a predetermined thickness, resin binder used for forming the bonding layer contains fillers including a first filler, which has a diameter generally equal to a target thickness of the bonding layer to be adjusted to a value within a range of proper thickness (from 25 mum to 200 mum). This can maintain the bonding layer within the range of proper thickness when the semiconductor element is bonded to the plate, and ensure on-board mounting reliability of the semiconductor device.</p> |
申请公布号 |
AU2003269495(A1) |
申请公布日期 |
2004.05.13 |
申请号 |
AU20030269495 |
申请日期 |
2003.10.09 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YOSHIYUKI WADA;TADAHIKO SAKAI |
分类号 |
H01L21/58;(IPC1-7):H01L23/31;B32B27/20 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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