发明名称 PACKAGE FOR STORING SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To overcome a problem that impedance decreases at a junction between a wiring conductor on a circuit board and a central conductor of a coaxial connector to enlarge reflection loss of high frequency signals and deteriorate operating properties of a semiconductor element. SOLUTION: The central conductor 7c of the coaxial connector 7 is connected with the wiring conductor 2a composed of a microstrip line etc. on a low dielectric part 2' of an insulating substrate 2 in a circuit board, and the length of the part of the central conductor 7c projecting inside the frame body 6 from an insulator 7b is under a quarter of the wavelength of a high frequency signal. The fluctuation in impedance at the junction part between the wiring conductor 2a and the central conductor 7c can be suppressed effectively. Moreover, since resonance is not generated in the central conductor 7c projecting from the insulator 7b, the reflection loss of high frequency signals can be extremely reduced, resulting in making the operating properties of the semiconductor element 8 satisfactory. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004140188(A) 申请公布日期 2004.05.13
申请号 JP20020303542 申请日期 2002.10.17
申请人 KYOCERA CORP 发明人 KABUMOTO MASANAO
分类号 H01L23/02;H01S5/022;(IPC1-7):H01L23/02 主分类号 H01L23/02
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