| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of evaluating adhesion forces between a substrate and all kinds of thin film being formed on the substrate. SOLUTION: In the method of the technology, a scribe line 9 is formed on a surface of a semiconductor wafer 1, and then the semiconductor wafer 1 is cleft along the scribe line 9 by using a cleaving blade 8, thereby separating off a wafer piece 1b. Next, the cleaving blade 8 is sent down vertically, and the wafer piece 1b is fixed in a gap 8a of the cleaving blade 8, and then the cleaving blade 8 is sent down obliquely, thereby peeling off an electrode film 2 in the rear surface of the semiconductor wafer 1, and the surface where the electrode film 2 is peeled of is observed or measured, thereby evaluating the adhesion force of the electrode film 2. COPYRIGHT: (C)2004,JPO
|
