| 摘要 |
<P>PROBLEM TO BE SOLVED: To determine an optimum adhesion parameter for wedge bonding. <P>SOLUTION: A bond adhesive power, ultrasonic variable and at least other one bond adhesion parameter of an apparatus for ball bonding can be determined in a plurality of bond adhesion cycles predetermined. That is, in each bond adhesion cycle, after a wire ball is fitted to a connection point 4 of a semiconductor chip 5, (a) the bond adhesion power predetermined is applied; (b) a capillary 1 is moved from a bond adhesion position horizontally as predetermined while monitoring a drive current of the capillary; (c) when a current is decreased, at once the capillary 1 is stopped moving; (d) a maximum current is determined from a progress of a current set between steps (b) and (c); (e) the capillary 1 is moved to the bond adhesion position; and (f) a wire ball is fitted to a connection point 4 of the semiconductor chip 5. Thus, an optimum bond adhesion parameter is determined. <P>COPYRIGHT: (C)2004,JPO |
