METHOD OF FORMING BASE FILM HOLE, FILM CARRIER TAPE, AND CARRIER TAPE PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a base film hole in which size of hole of film carrier tape and allocation interval can be reduced and free from displacement and deformation of hole.

SOLUTION: The base film 10 including a first conductor layer 12 at one surface and a second conductor layer 11 at the other surface is prepared. Thickness of the first conductor layer is thinner than the second conductor layer. A resist film 14A is provided on the first conductor layer and the resist film is defined as the resist layer 14 having formed a hole pattern. A hole 12A is provided to the predetermined position by etching the first conductor layer using the resist layer. Thereafter, the first conductor layer having the holes is used as a mask and a hole 16 is formed to the base film through radiation of the laser beam via the mask. Next, an etching nozzle 17 is allocated to one surface side of the base film and the first conductor layer as the mask can be removed by spraying the etching solution 18 from the etching nozzle.

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