| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer positioning device which can angularly position a wafer by rotating the wafer in a non-contact state without using a rotating mechanism by a motor, etc., in an inspecting stage or the like for prealigning the wafer with respect to the inspecting stage. SOLUTION: The wafer positioning device includes three or more non-contact suction heads each for floating and chucking the wafer by utilizing the reduced pressure of a Verneuil effect caused by an air jet. The wafer is infinitesimally inclined by turning off the air of at least one of the heads or changing its flow rate, and the wafer is rotated by rotating the direction of the inclination in a clockwise or counterclockwise direction. COPYRIGHT: (C)2004,JPO |
