| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board on which the electrode of an electronic component can be connected firmly to a soldering pad. SOLUTION: After the surface of an insulating substrate 1 is coated with an electroless-plated copper layer 3a, a first resist layer 11 having an opening 11a is formed on the copper layer 3a and an electroplated copper layer 3b and an electroplated nickel layer 5 are formed on the exposed portion of the copper layer 3a. Then, after the first resist layer 11 is peeled off, a second resist layer 12 having a second opening 12a through which the electroplated copper layer 3b and nickel layer 5 are exposed to their side faces is formed on the electroless-plated copper layer 3a. Then an electroplated gold layer 6 is formed on the surfaces of the electroplated copper layer 3b and nickel layer 5. Thereafter, the second resist layer 12 is peeled off and the soldering pad 3 is formed by etching off the electroless-plated copper layer 3a except the portion on which the pad 3 is formed. Finally, a solder-resistant resin layer 4 is formed. COPYRIGHT: (C)2004,JPO
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