| 摘要 |
PURPOSE: A ball mount module for semiconductor fabrication process is provided to improve productivity by performing efficiently a ball mounting process for mounting a ball from a ball supply block to a ball pad of a semiconductor substrate. CONSTITUTION: A ball mount module is formed with a vacuum housing(120), a ball pickup tool(130), and a ball map sheet(150). The inside of the vacuum housing(120) forms a vacuum by a vacuum absorbing power of a vacuum line. A plurality of holes are formed on the ball pickup tool(130). The ball pickup tool(130) and the vacuum housing(120) are combined by a screw(140). The ball pickup tool(130) is used for picking up balls(70). A plurality of holes are formed on the ball map sheet(150). The ball map sheet(150) and the ball pickup tool(130) are combined by a plurality of bolts(160).
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