| 摘要 |
<p>A method and a device for producing holes in workpieces by using at least one laser beam, in particular a short-pulse or ultrashort-pulse laser beam, whereby a process gas is supplied to the point of contact of the laser beam with the workpiece. At least one parameter of the process gas, i.e., its composition, pressure, volume flow, for example, is selected and the process gas is supplied to the interaction zone between the laser beam and the workpiece in such a way that the hole produced by the laser beam has a desired quality (hole geometry, reduced ablation residues, or none at all, etc.).</p> |
