APPARATUS FOR BREAKING IN WAFER RETAINER RING AND METHOD FOR USING THE SAME

摘要

PURPOSE: An apparatus for breaking in a wafer retainer ring is provided to prevent a wafer from being contaminated and scratched and improve an operation rate of a CMP(chemical mechanical polishing) apparatus by breaking in the wafer retainer ring before the wafer retainer ring is loaded into the CMP apparatus. CONSTITUTION: A shaft(30) capable of rotating is prepared. A plate(35) includes a wafer retainer ring attaching unit capable of attaching a retainer ring of the CMP apparatus. A platen(36) includes a wafer retainer ring polishing unit capable of polishing the wafer retainer ring attached to the plate.