| 摘要 |
A multi-chip apparatus is disclosed. In one form, the apparatus includes a carrier having a number of integrated circuit chips electrically coupled in a communications ring. The communications ring has carrier portions on the carrier and chip portions traversing the respective chips, permitting the communications ring carrier portions to be substantially straight, whereas at least one of the chip portions has a turn, enabling closure of the ring. In another aspect, the chips include respective regeneration circuitry interposed in the respective chip portions of the communications ring, for regenerating communications signals traversing the respective chips on the respective chip portions of the ring.
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