| 摘要 |
Devices for transducing electromagnetic information are formed on and from a wafer substrate. The devices comprise a head attached to a flexible element such as a gimbal. To create such a device, a transducer and an optional amplifier are formed on a wafer that is then cut into rows containing a number of such transducers. The rows are then processed from directions generally normal to the wafer surface upon which the transducer was formed, by removing material to form a head and flexible elements such as a gimbal, creating a media-facing surface on the head and at least one aperture adjacent the head. Conductive leads may be formed on a non-media-facing surface of a flexible element to connect the transducer with drive electronics. Conventional problems of connecting the head to the flexure and/or gimbal are eliminated, as both are made from the same wafer on which the transducer is formed. The transducer layers may be oriented generally perpendicular to the media surface, making use of proven transducer designs. The heads can be made thinner than is conventional and do not need a large area on the trailing surface for bonding pads, reducing their mass and moment arms. Low profile gimbals and flexures created with this invention can be more closely aligned with forces arising from interaction with the media surface and from seeking various tracks, reducing torque and dynamic instabilities. Spacing between disks can be reduced due to the thin heads and low profile gimbals and flexures.
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