| 摘要 |
An optoelectronic module includes a transmitting and/or receiving element, a support on which the transmitting and/or receiving element is disposed, and a module housing having an opening for introducing the support and a coupling region for the coupling attachment of a component to be coupled on. The module housing is filled with a molding of a translucent, moldable material. A separate coupling lens for coupling light between the transmitting and/or receiving element and the component to be coupled on is provided, which lens is disposed adjacent to the molding in or just before the coupling region in the module housing. The invention also relates to several methods for producing such a module.
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