ELECTRICAL INTERCONNECTION STRUCTURE WITH LINER MADE OF Ti AND TiN, AND FORMING METHOD THEREOF

摘要

PURPOSE: An electrical interconnection structure and a forming method thereof are provided to prevent contaminants from reacting to copper and to restrain the copper from reacting to dielectric by using a liner made of Ti and TiN. CONSTITUTION: A plurality of heat-resistive material contacts(50) are embedded in a first interlevel dielectric(20). A second interlevel dielectric(25) containing carbon is formed on the first interlevel dielectric. An opening is formed in the second interlevel dielectric to expose the contact to the outside. At this time, the carbon of the second interlevel dielectric is deposited on the contact. A first liner made of Ti for gettering the carbon is deposited thereon. A second liner made of TiN is deposited on the first liner. An interconnection layer(60) made of copper is formed on the resultant structure including the opening.