发明名称 |
SEMICONDUCTOR DEVICE HAVING MIM STRUCTURE CAPACITOR AND FORMING METHOD THEREOF |
摘要 |
PURPOSE: A semiconductor device having an MIM(Metal Insulator Metal) structure capacitor and a forming method thereof are provided to be capable of obtaining a predetermined lower storage node having a larger surface than that of a conventional lower storage node. CONSTITUTION: A semiconductor device is provided with a semiconductor substrate, an interlayer dielectric(104) formed on the semiconductor substrate, a plurality of buried contact plug(107) connected to predetermined regions of the semiconductor substrate through the interlayer dielectric, and an oxidation barrier pattern(110a) located on the buried contact plug. The semiconductor device further includes a lower storage node(117a) located on the oxidation barrier pattern. At this time, the upper portion of the oxidation barrier pattern has the same surface area as the lower portion of the lower storage node.
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申请公布号 |
KR20040037852(A) |
申请公布日期 |
2004.05.08 |
申请号 |
KR20020066520 |
申请日期 |
2002.10.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG, NAK WON;JU, HEUNG JIN;LEE, SANG YEONG |
分类号 |
H01L27/04;H01L21/02;H01L21/316;H01L21/768;H01L21/8242;H01L21/8246;H01L27/108;H01L27/115;(IPC1-7):H01L27/04 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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