发明名称 |
COMPRESSION WELDING METHOD |
摘要 |
PURPOSE: A compression welding method is provided to weld glass plates having various sizes to silicon, ceramic or a metal substrate at a low temperature and low pressure environment. CONSTITUTION: A metal welding layer(33) is patterned on an upper surface of a substrate(31). Then, a welding member(35) is aligned on the metal welding layer(33). Then, heat is applied to the substrate(31) while applying pressure to the metal welding layer(33) so that the metal welding layer(33) is melted, thereby welding the substrate(31) to the welding member(35). The substrate(31) includes a silicon substrate or a ceramic substrate. The metal welding layer(33) includes an aluminum layer. The welding member(35) includes an optical device made from glass.
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申请公布号 |
KR20040037375(A) |
申请公布日期 |
2004.05.07 |
申请号 |
KR20020065843 |
申请日期 |
2002.10.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KOO, JA NAM;SERGEY, POTAPOV |
分类号 |
B23K20/02;(IPC1-7):B23K20/00 |
主分类号 |
B23K20/02 |
代理机构 |
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主权项 |
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