发明名称 COMPRESSION WELDING METHOD
摘要 PURPOSE: A compression welding method is provided to weld glass plates having various sizes to silicon, ceramic or a metal substrate at a low temperature and low pressure environment. CONSTITUTION: A metal welding layer(33) is patterned on an upper surface of a substrate(31). Then, a welding member(35) is aligned on the metal welding layer(33). Then, heat is applied to the substrate(31) while applying pressure to the metal welding layer(33) so that the metal welding layer(33) is melted, thereby welding the substrate(31) to the welding member(35). The substrate(31) includes a silicon substrate or a ceramic substrate. The metal welding layer(33) includes an aluminum layer. The welding member(35) includes an optical device made from glass.
申请公布号 KR20040037375(A) 申请公布日期 2004.05.07
申请号 KR20020065843 申请日期 2002.10.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KOO, JA NAM;SERGEY, POTAPOV
分类号 B23K20/02;(IPC1-7):B23K20/00 主分类号 B23K20/02
代理机构 代理人
主权项
地址