| 摘要 |
PURPOSE: A method and an apparatus for manufacturing spherical silica powder are provided to manufacture silica powder to be used as silicon wafer abrasive and filler of epoxy filling for manufacturing integrated circuit package into powder formed in a spherical shape and uniformly distributed. CONSTITUTION: The apparatus(10) comprises a supersonic wave generator(12) for forming silica sol into droplet having a certain size using supersonic waves; a heating element(16) installed in such a way that the droplet is transferred through tube(18) and injected into the reaction furnace; a reaction furnace(20) for forming spherical silica powder(24) by heating the droplet supplied through the tube to a certain temperature; a collector(26) comprising a filter cloth for collecting powder particles; and an aspirator(30) installed on the circumference of the collector so that the silica powder passing through the reaction furnace is collected in the collector, wherein an inner temperature of the reaction furnace is from 100 to 300 deg.C, wherein the silica sol is manufactured using colloidal silica as a principal raw material, wherein the silica sol is manufactured by mixing the colloidal silica with one or more of solvents selected from water, isopropyl alcohol and acid, wherein the apparatus further comprises a cooling part(22) for condensing moisture in the droplet vaporized in the reaction furnace, and wherein the tube is formed in such a shape that the droplet coming out of the supersonic wave generator is turned around by 180 degrees of an angle before being injected into the reaction furnace.
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