| 摘要 |
<p>Preparation of spacer assembly, comprises coating release agent on mold, arranging substrate in mold, filling spacer forming material, moldings, removing mold, and heat treating resultant moldings. Preparation of a spacer assembly consisting of a substrate and spacer columns on the substrate comprises coating releasing agent containing organic component decomposing upon heating, fit the substrate tightly in the mold, and filling in material for forming the spacers, curing the spacer material and heating the mold at a first temperature to decompose or burn the organic component coating, removing the substrate from the mold, heating the spacer material at a second temperature higher than the first temperature to remove binder, and then sintering the molding at a third temperature higher than the previous temperatures. Independent claims are also included for: (1) a similar preparation for an assembly comprising a planar grid having pores passing multiple beams wherein a planar grid is used having a first and second surfaces and multiple spacer openings at the pores passing beams, uses first and second molds, and the moulds are fitter tightly on the first and second surfaces of the grid, the spacer openings are lined up against the through holes of the first and second molds, and the spacer material is filled through the holes of the molds; and (2) a similar preparation wherein spacers are formed and cured in the first and second molds separately.</p> |
