KLEBSTOFFBESCHICHTETE KUPFERFOLIE, KUPFERVERKLEIDETES LAMINAT UND BEDRUCKTE LEITERPLATTE BEIDE HIERAUS HERGESTELLT

摘要

A resin coated copper foil obtained by disposing on one side of a copper foil a layer of an adhesive composition having as essential components (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as required, and (d) a compound having a triazine ring or an isocyanuric ring, has low water absorption, high heat resistance and good adhesion to the copper foils, and by using this resin coated copper foil it is possible to obtain a copper-clad laminate and a printed circuit board having excellent properties.