| 摘要 |
A heat-sinking apparatus (62, 64, 66, and 68) containing a light-transparent pane (72) is configured in a way that enables the pane to be brought into contact with a device (40) such as a semiconductor device without significantly damaging the pane. A main spreader body (120) of a heat spreader (66) in the heat-sinking apparatus preferably consists largely of copper and is connected to the pane, preferably consisting largely of diamond, by way of a combination of metals that facilitates heat transfer from the pane to the heat spreader.
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