Surface acoustic wave device having high dielectric strength and process for manufacturing the same

摘要

Surface acoustic wave device (11) includes piezoelectric substrate (12), and electrode section having thin-film structure including interdigital electrodes (13, 14) and junction electrodes (15, 16). Each electrode (13, 14) includes a first base layer containing tantalum and copper layers or copper metal alloy layers each disposed on corresponding base layer. Metal includes silver, tin, or carbon. An independent claim is also included for a method of manufacturing a surface acoustic wave device by forming a multi-layer film, etching the multi-layer film to form interdigital electrodes, forming junction electrodes each connected to the interdigital electrodes, and heat-treating the piezoelectric substrate having interdigital electrodes and junction electrodes.