Module, especially a wafer module

摘要

The module (10) described is in particular a wafer module, and has two oppositely situated functional elements (11, 12) which are functionally interconnected by a compression-deformable joining agent layer (13) located in between. At least one functional element (11; 12; 11, 12) is surface-structured to form a recess (14), and the functional connection is present exclusively in the region of the recess (14).