发明名称 |
Plasma ashing process |
摘要 |
A substantially oxygen-free and nitrogen-free plasma ashing process for removing photoresist in the presence of a low k material from a semiconductor substrate includes forming reactive species by exposing a plasma gas composition to an energy source to form plasma. The plasma gas composition is substantially free from oxygen-bearing and nitrogen-bearing gases. The plasma selectively removes the photoresist from the underlying substrate containing low k material by exposing the photoresist to substantially oxygen and nitrogen free reactive species. The process can be used with carbon containing low k dielectric materials.
|
申请公布号 |
US2004084412(A1) |
申请公布日期 |
2004.05.06 |
申请号 |
US20030638570 |
申请日期 |
2003.08.11 |
申请人 |
WALDFRIED CARLO;ESCORCIA ORLANDO;HAN QINGYUAN;BUCKLEY THOMAS;SAKTHIVEL PALANI |
发明人 |
WALDFRIED CARLO;ESCORCIA ORLANDO;HAN QINGYUAN;BUCKLEY THOMAS;SAKTHIVEL PALANI |
分类号 |
G03F7/42;H01L21/02;H01L21/311;H01L21/3213;(IPC1-7):C23F1/00 |
主分类号 |
G03F7/42 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|