发明名称 NON-PERIPHERALS PROCESSING CONTROL MODULE HAVING IMPROVED HEAT DISSIPATING PROPERTIES
摘要 The present invention features a non-peripherals-based processing control unit having an encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.
申请公布号 WO2004038526(A2) 申请公布日期 2004.05.06
申请号 WO2003US33538 申请日期 2003.10.22
申请人 ISYS TECHNOLOGIES 发明人 SULLIVAN, JASON, A.
分类号 G06C;G06F1/16;H05K7/00 主分类号 G06C
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