发明名称 |
INTEGRATED CIRCUIT PACKAGE CONFIGURATION INCORPORATING SHIELDED CIRCUIT ELEMENT STRUCTURE |
摘要 |
An electromagnetically-shielded high-Q inductor may be fabricated within a multi-layer package substrate (MLS). The inductor is preferably constructed as a loop structure on a layer of the MLS, and a shielding structure is formed around the inductor to substantially enclose the inductor in a Faraday cage-like enclosure. The shielding structure includes a top plate formed above the inductor on another layer of the MLS, and a bottom plate formed on yet another layer of the MLS or on a layer of an integrated circuit die which is below and attached to the MLS, preferably using solder bumps. Shielding structure sidewalls may be formed by a ring of stacked vias or via channels. The inductor is preferably connected to stacked vias which provide a connection to the underlying integrated circuit die by way of additional solder bumps and cut-outs through the bottom plate of the shielding structure. |
申请公布号 |
AU2003282838(A1) |
申请公布日期 |
2004.05.04 |
申请号 |
AU20030282838 |
申请日期 |
2003.10.15 |
申请人 |
SILICON LABORATORIES, INC. |
发明人 |
DERRICK, C. WEI;YING SHI;KEVIN, G. SMITH;STEVEN, P. PROFFITT;AXEL THOMSEN;DAVID, M. PIETRUSZYNSKI;LIGANG ZHANG |
分类号 |
H01L23/552;H01L23/64 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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