发明名称 |
Wafer-level coated copper stud bumps |
摘要 |
A method for forming a semiconductor die package is disclosed. In one embodiment, the method includes forming a semiconductor die comprising a semiconductor device. A plurality of copper bumps is formed on the semiconductor die using a plating process. An adhesion layer is formed on each of the copper bumps, and a noble metal layer is formed on each of the copper bumps. |
申请公布号 |
US6731003(B2) |
申请公布日期 |
2004.05.04 |
申请号 |
US20030386621 |
申请日期 |
2003.03.11 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
JOSHI RAJEEV;TANGPUZ CONSUELO;CRUZ ERWIN VICTOR R. |
分类号 |
H01L21/60;H01L23/485;H01L29/78;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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