ETCHER FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: An etcher for fabricating a semiconductor device is provided to smoothly supply heat transfer gas for uniformly distributing the heat in a wafer by making the first block of a nozzle part include a plurality of gas supply paths. CONSTITUTION: An etch process is performed in a chamber(100). A chuck is located inside the chamber. A substrate is placed on the chuck having a groove on its upper surface. The nozzle part(200) supplies gas to a space between the lower surface of the substrate and the groove to make the temperature of the substrate placed on the chuck uniform. The nozzle part includes a curved gas supply path to minimize the induction of the process byproducts in the chamber into the gas supply path.