CONDUCTIVE ELECTROLESS PLATING POWDER AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide conductive electroless plating powder having plating films of improved adhesion properties and a method for manufacturing the same. SOLUTION: The conductive electroless plating powder is formed with a nickel film by an electroless plating method on the surface of the core member powder and is characterized in that grain boundaries are oriented in mainly the thickness direction of the nickel film. An electroless plating layer of gold may be formed on the extreme surface. The nickel film is formed by the electroless plating method using glycine or ethylenediamine as a complexing agent. COPYRIGHT: (C)2004,JPO