| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device mounting method which can reduce a defect occurrence rate and a semiconductor device repair method which can readily repair the defects at a soldering joint part. <P>SOLUTION: On a substrate 1, a penetrating hole 7 provided with a wiring layer 9 inside is formed, and a soldering ball 6 is so fused to cover the penetrating hole 7. In a mounting process or a repair process, a heating probe 41 is stuck into the soldering ball 6 through the penetrating hole 7 to melt the soldering ball 6, and after that, the heating probe 41 is pulled out and the soldering ball 6 is coagulated. According to this process, only the soldering ball 6 is heated without having any adverse effect on an IC chip 3. Also, in the repair process, the soldering ball 6 can be restored to the initial condition with no inter-metallic compound. <P>COPYRIGHT: (C)2004,JPO</p> |
