| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment method for miniaturizing a device by using a treatment fluid supply source in which the supply capability of the treatment fluid is small, reducing a cost and improving throughput, and to provide a substrate treatment device. SOLUTION: The substrate treatment method supplies ozone gas from one ozone gas generator to a plurality of ozone treatment units 23a-23f, then performs resist water soluble treatment on a wafer W, and conveys it to a plurality of prepared washing treatment units 12-15 to perform washing. The supply amount of the ozone generator is set smaller than a necessary amount of ozone gas when all the ozone treatment units 23a-23f are used, and timing for charging the wafer W to the ozone treatment units 23a-23f is controlled so that timing supplying ozone gas to the plurality of the ozone treatment units 23a-23f used simultaneously does not exceed the set supply amount of the ozone generator. COPYRIGHT: (C)2004,JPO
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