| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for plasma treatment by which a more uniform deposited film can be formed on a substrate. SOLUTION: In this method, plasma treatment is performed on the substrate set up in a depressible reaction chamber under a plurality of plasma treating conditions by forming plasma in the chamber by supplying high-frequency power to the chamber, in a state where the substrate is rotated by means of a rotating mechanism. The rotational position of the substrate at the changing timing of the plasma treating conditions is changed at every timing. COPYRIGHT: (C)2004,JPO
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