| 发明名称 |
METHOD FOR PRODUCING CONTACTS AND PRINTED CIRCUIT PACKAGES |
| 摘要 |
Before producing one or more contact channels (30) or the contact locations (24), a covering is applied. Preparation of the surface region comprises thinning the substrate material. Those contact channels (31) starting from the second surface region connect directly to the contacts. An independent claim is included for the device so produced. |
| 申请公布号 |
KR20040036735(A) |
申请公布日期 |
2004.04.30 |
| 申请号 |
KR20047002747 |
申请日期 |
2002.08.26 |
| 申请人 |
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发明人 |
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| 分类号 |
H01L21/60;H01L23/52;H01L;H01L21/00;H01L21/3205;H01L21/44;H01L21/76;H01L21/768;H01L23/00;H01L23/12;H01L23/31;H01L23/485;H01L25/16;H01L27/146;H01L31/02;H01L31/0203 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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