CHEMICAL MECHANICAL POLISHING(CMP) EQUIPMENT

摘要

PURPOSE: A CMP(Chemical Mechanical Polishing) equipment is provided to be capable of maximizing the conditioner effect of a pad and increasing the life time of the pad. CONSTITUTION: A CMP equipment(100) is provided with a platen assembly including a platen(112) for loading a polishing pad(113) and a polishing head assembly for conserving and pressing a wafer. At this time, the polishing head assembly includes a housing(122), a spin body part(124) capable of rotating on the housing, a polishing head installed at the spin body part for performing revolution, and a conditioner head(128) installed at the spin body part for being rotated by the spin body part. Preferably, the conditioner head includes a body part(128a) fixed to the spin body part and a conditioner(128b) installed at the body part. Preferably, the conditioner is a disc type structure.