| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing and die bond film excellent in balance characteristic of holding force in the case of dicing a work and peelability in the case of peeling a chip-state work obtained by dicing integrally with the adhesive layer for die bond. <P>SOLUTION: The dicing and die bond film has an adhesive layer 2 on a supporting base material 1 and has the adhesive layer for die bond 3 on the adhesive layer 2. The peelability of the interface of the adhesive layer 2 and the adhesive layer for die bond 3 is different between an interface A corresponding to a work pasting part 3a on the adhesive layer for die bond 3 and an interface B corresponding to a part or all of the other part 3b. The peelability of the interface A is larger than that of the interface B. <P>COPYRIGHT: (C)2004,JPO |
