发明名称 CONDUCTIVE PASTE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a conductive paste which can maintain functions as a back surface electrode of a Si solar cell, when it is used as the back surface electrode of the Si solar cell, while simultaneously reducing warpage of a Si wafer with the baking contraction of an electrode film being small at baking. <P>SOLUTION: This conductive paste contains Al powder, a glass frit, an organic vehicle, and particles which is refractory or is insoluble in the organic vehicle. This particle is at least one kind of an organic compound particle and a carbon particle to be used for forming the back surface electrode of the Si solar cell. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004134775(A) 申请公布日期 2004.04.30
申请号 JP20030321428 申请日期 2003.09.12
申请人 MURATA MFG CO LTD 发明人 NAGAKUBO HIROSHI;ADACHI FUMIYA
分类号 H01L31/04;H01B1/16;H01B1/18;H01B1/22;H01L31/0224;H05K1/09;(IPC1-7):H01L31/04 主分类号 H01L31/04
代理机构 代理人
主权项
地址
您可能感兴趣的专利