| 摘要 |
PROBLEM TO BE SOLVED: To provide an interlayer insulating adhesive which can reduce a resin left after a desmear treatment and improve interlayer conduction reliability. SOLUTION: This interlayer insulating adhesive is characterized by containing the first epoxy resin, the second epoxy resin different from the first epoxy resin, a polyether sulfone resin, silica and a phosphine oxide compound as essential components. The resin-adhered metal foil is characterized by being obtained by laminating the interlayer insulating adhesive to the metal foil. COPYRIGHT: (C)2004,JPO |
