WAFER CLEANING APPARATUS

摘要

PURPOSE: A wafer cleaning apparatus is provided to be capable of easily controlling the concentration of a mixed solution of ozone water and HF. CONSTITUTION: A wafer cleaning apparatus(100) is provided with the first chemical unit(110) for storing the first chemical, the second chemical unit(120) for storing the second chemical, and a process chamber(140) for forming a mixed solution by using the first and second chemical supplied from the first and second chemical unit and cleaning the surface of a wafer using the mixed solution. The wafer cleaning apparatus further includes a concentration control part(130) between the chemical units and the process chamber. Preferably, a flow control valve is used as the concentration control part. Preferably, the first chemical is ozone water. Preferably, the second chemical is HF.