CHIP SIZE PACKAGE FABRICATED BY SIMPLE PROCESS AND FABRICATING METHOD THEREOF TO REDUCE MANUFACTURING COST

摘要

PURPOSE: A semiconductor package is provided to reduce the manufacturing cost by simplifying a fabrication process in comparison with a conventional plastic package process. CONSTITUTION: A plurality of electrode pads(12) are formed in a semiconductor chip(11). A couple of lead frames(13a,13b) having left and right symmetrical L-shaped structures are adhered to both sides of the semiconductor chip. A wire(15) is used for connecting the electrode pads to the lead frames. A conductive bump is adhered on each top end of the lead frames. A ceramic cap(18) is inserted and fixed to the lead frames in order to seal up a top space of the semiconductor chip.