LIQUID TREATMENT APPARATUS AND LIQUID TREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide a liquid treatment apparatus and a liquid treatment method which realize effective improvement in the in-plane uniformity of liquid treatment for a substrate. SOLUTION: A diaphragm 25 partitioning a cathode region and an anode region and a frame 26 supporting the diaphragm are arranged inside an inner tank 19 storing a plating liquid. The frame 26 is connected with a tube 35 capable of extending and contracting by the operation of a feed tube extension-contraction mechanism 38. Using the electroplating apparatus 1, plating is applied to a wafer W while moving the central counter part 25c of the diaphragm 25 upward and downward. COPYRIGHT: (C)2004,JPO