发明名称 SOLDERING METHOD REQUIRING NO FLUX
摘要 PROBLEM TO BE SOLVED: To provide a soldering method requiring no flux. SOLUTION: Solder 6 is arranged on the soldering face 2a of one of the two objects 2, 4 to be soldered. While a free radical gas is supplied to this soldering face 2a and the soldering face 4a of the other object 4, the two objects 2, 4 are heated to a temperature at which the solder 6 is melted and are then cooled. The soldering face 2a on which the solder 6 is melted is superposed on the soldering face 4a of the other object 4, heated at the melting temperature of the solder 6, and subsequently cooled. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004130351(A) 申请公布日期 2004.04.30
申请号 JP20020297867 申请日期 2002.10.10
申请人 SHINKO SEIKI CO LTD 发明人 KAGAMI JOJI;MORI TAKESHI;TAKEUCHI TATSUYA;MATSUURA YOSHIKAZU
分类号 B23K1/20;B23K31/02;(IPC1-7):B23K1/20 主分类号 B23K1/20
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