METAL LINE METHOD EVEN THOUGH IT HAS UNDERCUT

摘要

PURPOSE: A metal line method is provided to connect the metal line to the via hole having the undercut by using an ion milling unit. CONSTITUTION: A MEMS(Micro-Electronic Mechanical System) device(23) is installed on an upper surface of a silicon substrate(22). A glass wafer is adhered to an upper surface of the silicon substrate(22) having the MEMS device(23). In a MEMS packaging process for adhering the glass to the silicon substrate, a metal layer is deposited on a hole(26) of the glass wafer(24). The deposited layer is redeposited by performing an ion milling process.