发明名称 Substrate treatment device, substrate treatment method, and cleaning method for substrate treatment device
摘要 A substrate treatment device includes: a treatment chamber in which a substrate is to be placed; a supply system configured to supply at least two kinds of treatment gases into the treatment chamber; an exhaust system having a pump, configured to exhaust the treatment gases from the treatment chamber; and a capturing unit interposed between the treatment chamber and the pump and containing fine grains, configured to capture by the fine grains at least one kind of the treatment gas exhausted from the treatment chamber.
申请公布号 US2004081757(A1) 申请公布日期 2004.04.29
申请号 US20030650087 申请日期 2003.08.28
申请人 TOKYO ELECTRON LIMITED 发明人 ISHIZAKA TADAHIRO;KAWAMURA KOHEI;YOKOI HIROAKI;SHIMIZU TAKAYA;SHIGEOKA TAKASHI;OSHIMA YASUHIRO;KOJIMA YASUHIKO
分类号 B08B5/00;C23C16/44;H01L21/285;H01L21/31;(IPC1-7):C23C16/00 主分类号 B08B5/00
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