发明名称 |
Substrate treatment device, substrate treatment method, and cleaning method for substrate treatment device |
摘要 |
A substrate treatment device includes: a treatment chamber in which a substrate is to be placed; a supply system configured to supply at least two kinds of treatment gases into the treatment chamber; an exhaust system having a pump, configured to exhaust the treatment gases from the treatment chamber; and a capturing unit interposed between the treatment chamber and the pump and containing fine grains, configured to capture by the fine grains at least one kind of the treatment gas exhausted from the treatment chamber.
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申请公布号 |
US2004081757(A1) |
申请公布日期 |
2004.04.29 |
申请号 |
US20030650087 |
申请日期 |
2003.08.28 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
ISHIZAKA TADAHIRO;KAWAMURA KOHEI;YOKOI HIROAKI;SHIMIZU TAKAYA;SHIGEOKA TAKASHI;OSHIMA YASUHIRO;KOJIMA YASUHIKO |
分类号 |
B08B5/00;C23C16/44;H01L21/285;H01L21/31;(IPC1-7):C23C16/00 |
主分类号 |
B08B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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