Manufacturing method of airtight container, manufacturing method of image display device, and bonding method

摘要

An airtight container is made by, bonding a support frame and an electron source substrate by forming an underlayer on the support frame, providing a bonding agent on the underlayer, forming an oxide film that is different from the bonding agent on the electron source substrate, and bringing the bonding agent into contact with the oxide film. Manufacture of an airtight container comprises bonding a support frame and an electron source substrate by forming an underlayer on the support frame, providing a bonding agent on the underlayer, forming an oxide film that is different from the bonding agent on the electron source substrate, and bringing the bonding agent into contact with the oxide film. The wettability of the bonding agent to the underlayer is superior to that of the bonding agent to a surface of the support frame prior to the formation of the underlayer on the support frame. The bondability of the bonding agent to the oxide film is superior to that of the bonding agent to a surface of the electron source substrate prior to the formation of oxide film. The formation of an oxide film is performed after a predetermined treatment is performed for the electron source substrate. Independent claims are also included for: (a) a method for manufacturing an image display device having an airtight container and display elements placed in it, comprising forming the airtight container as above; and (b) a bonding method using a bonding agent, comprising forming an underlayer on a support frame; providing the bonding agent on the underlayer; forming an oxide film, which is different from the bonding agent, on an electron source substrate; and bringing the bonding agent into contact with the oxide film so that the support frame and the electron source substrate are bonded to each other, where the wettability of the bonding agent to the underlayer is superior to that of the bonding agent to a surface of the support frame before the underlayer is formed on it, and the bondability of the bonding agent to the oxide film is superior to that of the bonding agent to a surface of the electron source substrate before the oxide film is formed on it.